General Description

The Cool RoadRunner-LX800 is a high-performance PC/104-Plus board with AMD's Geode™ LX processor, having very low power requirements. The board comprises all peripherals needed for an embedded PC on a small 3.775" by 4.050" printed circuit board. It is fully plug-in compatible with the Cool RoadRunner 2, which was obsoleted due to end-of-life of the Geode GX1.

The Cool RoadRunner integrates a powerful yet efficient AMD Geode™ LX800 processor together with a CS5536 I/O companion and a Super I/O chip to form a complete PC, with all the standard peripherals already on board. There is graphics controller with VGA, LVDS, and parallel TFT adapters to connect many sorts of display terminals. Backlighting is provided for LCD modules.

A fast 100/10BaseT Ethernet port, RS232/RS42/RS485 serial ports, and four USB 2.0 host ports handle the communication with external devices. There are PS/2 connectors for keyboard and mouse as well as a parallel printer port available. Sound I/O according to AC97 is supported, too. An IDE ATA100 adapter allows connection of hard disk or CD drives. Applications that require non-moving storage can use the integrated Compact Flash socket.

System expansion is easily done using the PC/104 and PC/104-Plus connectors . I2C bus, PWM outputs, and programmable general purpose digital signals are available on a supervisory connector.

The Cool RoadRunner-LX800 is powered by a 5V-only supply and supports ACPI, advanced power management and PCI power management. Security critical applications take advantage of the Geode LX processor, too. It has an on-chip AES 128-bit crypto acceleration block capable of 44 Mbps throughput on either encryption or decryption. The AES block runs asynchronously to the processor core and is DMA based.

The Cool RoadRunner-LX800 runs Windows, Linux and VxWorks operating systems.

Links

Features

CPU

AMD Geode™ LX 800@1.0W (500MHz)
Cache Memory with:
64 KB/64 KB level 1 I/D caches
TLB (Translation Look-aside Buffer):
128 KB level 2 cache
Efficient Prefetch

Main Memory

One DDR333 SODIMM Module, up to 1GB
Recommended: 256MB at minimum

Chipset

AMD CS5536 companion device

Extension slots

1 x 32-bit PC/104-Plus
1 x 16-bit PC/104 with full DMA capability

Interfaces

Ethernet 10/100BaseT
Compact Flash Type III header
ATA-6 EIDE (Ultra DMA-100)
PS/2 Keyboard
PS/2 Mouse
4 x USB 2.0 ports
2 x RS232/RS485, software selectable
1 x parallel port
SVGA monitor
18 Bit Flat Panel
24 Bit LVDS for displays
Supervisory port: external power button, live
signal, watchdog, hardware monitoring and
some general purpose signals
Power supply

Specifications

Electrical Specifications

Supply voltage +5 V DC
Rise time < 5 ms
Supply voltage tolerance ± 5%
Inrush current 2.5 A
Supply current max.
- 1.5 A depending on operating system and RAM
- typ. 0.9 A (Windows XP idle mode)
- typ. 0.06 A (running Windows XP Suspend to RAM)

Environmental Specifications

Operating:

Temperature range
- -20 ... 60 °C (standard version)
- -40 ... 85 °C (extended version)
Temperature change max. 10K / 30 minutes
Humidity (relative) 10 ... 90 % (non-condensing)
Pressure 450 ... 1100 hPa

Non-Operating/Storage/Transport:

Temperature range -40 ... 85 °C
Temperature change max. 10K / 30 minutes
Humidity (relative) 5 ... 95 % (non-condensing)
Pressure 450 ... 1100 hPa

MTBF

MTBF at 25°C 364.293 hoursIn order to perform a failure rate assessment, several assumptions have to be made to minimize the complexity of the analysis.

Basis for the calculation was „Parts-Stress" method according to MIL-HDBK-217 F Notice 2. Although this method requires stress values for all components, mean stress values have been used.

Environmental factor „Ground Benign" according to MIL-HDBK-217 has been used as well as an environmental temperature of 25 °C.

Failure rate of mechanical components (screws, chassis, etc) is negligible.

The detailed analysis report is available on request.

Mechanical